Advanced cooling technology via boiling heat transfer considering the wettability of a heating surface

Noriyuki Unno;Xiang Yi Jia;Kazuhisa Yuki;Risako Kibushi;Shin-ichi Satake;Koichi Suzuki

Proceedings of 2017 International Conference on Electronics Packaging, ICEP 2017

2017-04

202

ENG

205

研究論文（国際会議プロシーディングス）