著作(論文等)
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Fine Fin Structure Suitable for SiC Inverter Cooling with Subcooled Flow Boiling
Hitoshi Yoshimura , Kazuhisa Yuki , Noriyuki Unno , Takuro Nakaoka , Mutsuaki Goto
Proceedings of International Conference of Electronics Packaging (ICEP2023)
2023-04
国際会議プロシーディングス
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