Heat transfer Performance of Two-Phase Immersion Cooling by Breathing Phenomena with Different Pore Structures of Lotus Copper

M. Terada, K. Yuki, N. Unno, R. Kibushi, T. Ogushi, M. Murakami, T. Numata, T. Ide, H. Nomura

Proceedings of 2022 International Conference on Electronics Packaging (ICEP 2022)

2022/05

研究論文（国際会議プロシーディングス）