著作(論文等)
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Heat Transfer Enhancement in Two-phase Immersion Cooling with FC-72
D. Tanaka , K. Yuki , N. Unno , K. Yuki , T. Ide , T. Ogushi , M. Murakami
Proceedings of International Conference of Electronics Packaging (ICEP2023)
2023/04
国際会議プロシーディングス
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