研究論文(学術雑誌)
Transactions of The Japan Institute of Electronics Packaging
Immersion Cooling of Electronics utilizing Lotus-Type Porous Copper
Kazuhisa Yuki, Tomohiro Hara, Soichiro Ikezawa, Kentaro Anju, Koichi Suzuki, Tetsuro Ogushi, Takuya Ide, Masaaki Murakami
9
0
E16
013