研究論文(国際会議プロシーディングス)
Proceedings of 2017 International Conference on Electronics Packaging, ICEP 2017
Advanced cooling technology via boiling heat transfer considering the wettability of a heating surface
Noriyuki Unno;Xiang Yi Jia;Kazuhisa Yuki;Risako Kibushi;Shin-ichi Satake;Koichi Suzuki
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