研究論文(国際会議プロシーディングス)
Proceedings of 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018
Thermal resistance evaluation in high heat flux electronics
R. Kibushi, K. Yuki, N. Unno, K. Yuki, T. Tomimura, T. Hatakeyama, M. Ishizuka
471
474