研究論文(国際会議プロシーディングス)
Proceedings of The 32nd International Symposium on Transport Phenomena (ISTP32)
EVALUATION OF HEAT FLOW IN A TO-220 PACKAGE MADE OF SIC USING CFD SIMULATION,
Risako Kibushi, Taichi Konishi, Tomoyuki Hatakeyama, Shinji Nakagawa, Noriyuki Unno, Kazuhisa Yuki, Masaru Ishizuka and Masaya Edatsugi