Joining of SiC Fiber-Bonded Ceramics using Silver, Copper, Nickel, Palladium, and Silicon-Based Alloy Interlayers

R.Asthana, M.Singh, H.T.Lin, T.Matsunaga, T.Ishikawa

International Journal of Applied Ceramic Technology

2013/01

10

5

801

～

813

学術論文(学術雑誌)